CVE-2016-2063
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Published:Mar 30, 2016
Last Modified:Apr 12, 2025
EPS:Aug 7, 2016
EPSS Score:0.00065
CVSS Score:7.8
Affected Products
Vendor
Product
Action
Vendor
Linux
Product
Linux Kernel
Linux
Linux Kernel
Exploits
No exploit reference
Common Weakness Enumeration
Common Attack Pattern Enumeration and Classification (CAPEC)
Related CVEs
References
Common Vulnerability Scoring System
Attack Vector
Network
Adjacent
Local
Physical
Privileges Required
None
Low
High
User Interaction
None
Required
Scope
Unchanged
Changed
Confidentiality
None
Low
High
Integrity
None
Low
High
Availability
None
Low
High
