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    CVE-2016-2063

    Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

    Published:Mar 30, 2016
    Last Modified:Apr 12, 2025
    EPS:Aug 7, 2016
    EPSS Score:0.00065
    CVSS Score:7.8

    Affected Products

    Vendor
    Linux
    Product
    Linux Kernel

    Exploits

    No exploit reference

    Related CVEs

    Common Vulnerability Scoring System

    Attack Vector
    Network
    Adjacent
    Local
    Physical
    Privileges Required
    None
    Low
    High
    User Interaction
    None
    Required
    Scope
    Unchanged
    Changed
    Confidentiality
    None
    Low
    High
    Integrity
    None
    Low
    High
    Availability
    None
    Low
    High