CVE-2017-18297
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Published:Oct 23, 2018
Last Modified:Nov 21, 2024
EPS:Oct 23, 2018
EPSS Score:0.00053
CVSS Score:7.8
Affected Products
Vendor
Product
Action
Vendor
Qualcomm
Product
Sd 425
Qualcomm
Sd 425
Vendor
Qualcomm
Product
Sd 425 Firmware
Qualcomm
Sd 425 Firmware
Vendor
Qualcomm
Product
Sd 430
Qualcomm
Sd 430
Vendor
Qualcomm
Product
Sd 430 Firmware
Qualcomm
Sd 430 Firmware
Vendor
Qualcomm
Product
Sd 450
Qualcomm
Sd 450
Vendor
Qualcomm
Product
Sd 450 Firmware
Qualcomm
Sd 450 Firmware
Vendor
Qualcomm
Product
Sd 625
Qualcomm
Sd 625
Vendor
Qualcomm
Product
Sd 625 Firmware
Qualcomm
Sd 625 Firmware
Vendor
Qualcomm
Product
Sd 650
Qualcomm
Sd 650
Vendor
Qualcomm
Product
Sd 650 Firmware
Qualcomm
Sd 650 Firmware
Vendor
Qualcomm
Product
Sd 652
Qualcomm
Sd 652
Vendor
Qualcomm
Product
Sd 652 Firmware
Qualcomm
Sd 652 Firmware
Vendor
Qualcomm
Product
Sd 820
Qualcomm
Sd 820
Vendor
Qualcomm
Product
Sd 820 Firmware
Qualcomm
Sd 820 Firmware
Exploits
No exploit reference
Common Weakness Enumeration
Common Attack Pattern Enumeration and Classification (CAPEC)
No CAPEC recorded yet
Related CVEs
References
Common Vulnerability Scoring System
Attack Vector
Network
Adjacent
Local
Physical
Privileges Required
None
Low
High
User Interaction
None
Required
Scope
Unchanged
Changed
Confidentiality
None
Low
High
Integrity
None
Low
High
Availability
None
Low
High
