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    CVE-2019-19196

    The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

    Published:Feb 12, 2020
    Last Modified:Nov 21, 2024
    EPS:Feb 12, 2020
    EPSS Score:0.00141
    CVSS Score:6.5

    Affected Products

    Vendor
    Telink-semi
    Product
    Tlsr8232
    Vendor
    Telink-semi
    Product
    Tlsr8232 Ble Sdk
    Vendor
    Telink-semi
    Product
    Tlsr8251
    Vendor
    Telink-semi
    Product
    Tlsr8251 Ble Sdk
    Vendor
    Telink-semi
    Product
    Tlsr8253
    Vendor
    Telink-semi
    Product
    Tlsr8253 Ble Sdk
    Vendor
    Telink-semi
    Product
    Tlsr8258
    Vendor
    Telink-semi
    Product
    Tlsr8258 Ble Sdk
    Vendor
    Telink-semi
    Product
    Tlsr8269
    Vendor
    Telink-semi
    Product
    Tlsr8269 Ble Sdk

    Exploits

    https://asset-group.github.io/disclosures/sweyntooth/https://asset-group.github.io/disclosures/sweyntooth/

    Common Vulnerability Scoring System

    Attack Vector
    Network
    Adjacent
    Local
    Physical
    Privileges Required
    None
    Low
    High
    User Interaction
    None
    Required
    Scope
    Unchanged
    Changed
    Confidentiality
    None
    Low
    High
    Integrity
    None
    Low
    High
    Availability
    None
    Low
    High