CVE-2022-25334
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.
Published:Oct 19, 2023
Last Modified:Nov 21, 2024
EPS:Oct 19, 2023
EPSS Score:0.00048
CVSS Score:8.2
Affected Products
Vendor
Product
Action
Vendor
Ti
Product
Omap L138
Ti
Omap L138
Vendor
Ti
Product
Omap L138 Firmware
Ti
Omap L138 Firmware
Exploits
No exploit reference
Common Weakness Enumeration
Common Attack Pattern Enumeration and Classification (CAPEC)
No CAPEC recorded yet
Related CVEs
Common Vulnerability Scoring System
Attack Vector
Network
Adjacent
Local
Physical
Privileges Required
None
Low
High
User Interaction
None
Required
Scope
Unchanged
Changed
Confidentiality
None
Low
High
Integrity
None
Low
High
Availability
None
Low
High
